Intel plans to build a semiconductor substrate manufacturing facility in India. The company is partnering with 3D Glass Solutions, Inc. (3DGS) to construct a facility in the eastern state of Odisha. The facility will take about six years to build and will cost $3.3 billion in joint investments from the two companies.
Once built, the facility will focus on producing high-density interconnect substrates and advanced packaging glass core substrates, which are used as bases for attaching semiconductor components, such as compute or graphics tiles. The project is pitched to create 1,800 jobs in and around the Bhubaneswar-Khurda region (via Yahoo Finance).
The chief minister of Odisha, Mohan Charan Majhi, wrote on X, "T...
English (US)